搜索结果: 1-1 共查到“电子科学与技术 Dummy fill”相关记录1条 . 查询时间(0.078 秒)
Critical Area Driven Dummy Fill Insertion to Improve Manufacturing Yield
Dummy fill Manufacturability Critical Area CMP
2014/12/8
Non-planar surface may cause incorrect transfer of patterns during lithography. In today’s IC manufacturing, chemical mechanical polishing (CMP) is used for topographical planarization. Since polish r...