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Bondig technique developed by CII-Honeywell Bull. The paper describes the geometry of bonding pads at the chip level, the design and realization of the corresponding high density 35 mm tape and the in...
Tape Automated Bonding for High Density Packaging
Tape Automated Bonding High Density Packaging
2011/1/5
High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.
Through the development ...