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MIT engineers “grow” atomically thin transistors on top of computer chips（图）
计算机芯片 原子薄晶体管 低温生长 集成电路
2023/6/6
Emerging AI applications, like chatbots that generate natural human language, demand denser, more powerful computer chips. But semiconductor chips are traditionally made with bulk materials, which are...
MIT engineers grow “perfect” atom-thin materials on industrial silicon wafers（图）
工业硅晶圆 原子薄材料 芯片
2023/6/6
True to Moore’s Law, the number of transistors on a microchip has doubled every year since the 1960s. But this trajectory is predicted to soon plateau because silicon — the backbone of modern transist...
Desktop simulation of MIT.nano die bonder enables virtual tool training（图）
MIT.nano芯片 虚拟工具培训 半导体器件
2023/6/6
Packaging is the final step in the process for manufacturing a semiconductor device. A critical tool for packing is the die bonder, which facilitates device assembly typically by attaching a chip in a...