搜索结果: 1-6 共查到“电子科学与技术 packaging”相关记录6条 . 查询时间(0.034 秒)
Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging
2007/7/28
期刊信息
篇名
Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging
语种
英文
撰写或编译
撰写
作者
W. Zhang,C. Z. Liu,D. X. Li,M. L. Sui
第一作者单位
Institute of Metal Research, C...
Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
a New Back Panel Packaging Approach DIN and Reversed DIN board connectors
2010/12/23
Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained ...
Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits
Versatile Packaging Concept Thick Film Hybrids Analog and Digital Circuits
2010/12/27
The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered t...
A chip and wire, high density packaging approach has resulted in a low cost, large scale, high density, multi-chip package (MCP). The package includes 76 ICs, 1 resistor, and 34 capacitor chips on a 2...
IC Packaging Technology for Electronic Watches
IC Packaging Technology Electronic Watches
2010/12/29
IC-Quartz watches have been manufactured since the appearance of CMOS-LSI about seven years ago. Nowadays, the outside view of the quartz watch is the same as that of a mechanical watch through minimi...
Tape Automated Bonding for High Density Packaging
Tape Automated Bonding High Density Packaging
2011/1/5
High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.
Through the development ...