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Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
a New Back Panel Packaging Approach DIN and Reversed DIN board connectors
2010/12/23
Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained ...
Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits
Versatile Packaging Concept Thick Film Hybrids Analog and Digital Circuits
2010/12/27
The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered t...
IC Packaging Technology for Electronic Watches
IC Packaging Technology Electronic Watches
2010/12/29
IC-Quartz watches have been manufactured since the appearance of CMOS-LSI about seven years ago. Nowadays, the outside view of the quartz watch is the same as that of a mechanical watch through minimi...